u-blox fleet management systems significantly reduce CO2 footprints through optimized routing, traffic prediction, speeding or harsh braking reduction, and preventative maintenance.
“Whereas the manufacturing process of a u-blox 8 chip produces slightly more than 50 grams of CO2, effective fleet management of a 40-tonnes truck supported by u-blox technology reduces CO2 emissions by 50 tonnes per year, a savings factor of one million.”
In addition to producing solutions that are beneficial, we are committed to ensuring our products are produced responsibly. Long before our products are shipped to market, the u-blox R&D team has invested significant IP and sustainability considerations into the value chain with product design, the right balance of capability, form factor, energy consumption, and component longevity, further reducing CO2 emissions.
At u-blox, we believe that component longevity makes sense. As a result, many of our customers’ products are manufactured to last and remain reliably in use for more than a decade. Components, therefore, need to be robust, highly reliable, easy to maintain, and, where required, continue to evolve with Firmware Over The Air (FOTA) after they leave the factory. Sustainability is good for our customers, good for their customers, and better for our planet.
“At u-blox, we believe that component longevity makes sense. As a result, many of our customers’ products are manufactured to last and remain reliably in use for more than a decade.”
u-blox engineers continuously collaborate with our suppliers to find innovative ways to improve and adopt new manufacturing technologies to optimize energy, water, and materials used while minimizing waste to protect the environment as much as possible during production.
The u-blox chip team designs for zero defect, robust life span, optimal form factor, and minimum energy consumption.
Through an extensive miniaturization project in 2021, we have extended the number of chips produced on one wafer by a factor of 2. We now produce 2 times as many components with the same amount of silicon, precious metals, and energy, effectively saving 50% on energy and materials. We have also designed our manufacturing process to use the minimum layer of metallization and implant options.
We test both hot and cold to screen any potentially defective parts as soon as possible. We save considerable energy by removing defective parts from the production flow as early in the manufacturing process as possible.
The u-blox chip team has designed our robust products to rely on simple package technology, i.e., quad flat no-lead package (QFN), which does not require a substrate. We have also moved from gold wire bonding to copper to optimize environmental impact further.
We minimize transport from wafer-tester-stock throughout the manufacturing process and perform the final test precisely at the location where we have our stock to avoid the environmental impact of additional transportation.