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Hazardous Substances


Solder

The substances described below are subject to be eliminated in electric and electronic equipment by July 1, 2006.
Lead (Pb) Mainly used in solder, active and passive electric components, electronic contacts and BGA balls, ceramics, glass

Cadmium (Cd) Ni-Cd rechargeable batteries, galvanic coatings, polymers, electric contacts, sensors

Mercury (Hg) Batteries, light sources, switches, relays, sensors,

Hexavalent
Chromium
Coatings on metals, corrosion protection, metal coated plastics


PBB, PBDE polybrominated biphenyls and polybrominated diphenyl ethers: Flame resistant material for cables, etc.


 
 
/technology/leadfree/substance...
last modified: 09.02.2005

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